Articles

Integrated analysis solution offered by Invarian helps designers to overcome existing analysis problems without additional flow complexity and runtime penalty.

By Alex Samoylov, Invarian.  EDACafe.com, 09/24/2010

InVar, the first tool that implements concurrent co-simulation (co-analysis) for power, timing,
temperature, and IR drop, addresses the predictability and reliability issues of the current analysis
flows.

By Alex Samoylov, Invarian.  EDACafe.com, 04/16/2010

Thermal analysis must be tightly integrated with analysis tasks throughout the design implementation flow.

By John Kane, Magma Design Automation. Published in June 2008 issue of Chip Design Magazine

This year's Design Automation Conference had no shortage of established vendors and start-ups introducing power tools purporting to give digital-IC designers a better way to estimate power.

By Michael Santarini, Senior Editor -- EDN, 9/15/2005

With the aggressive downscaling of technology nodes and ever-increasing on-chip power consumption, thermal management is becoming a significant design challenge for high-performance microprocessors, integrated network processors, and SoCs. It’s a problem that’s only going worsen, and it needs to be addressed by the EDA industry.

By Amir H. Ajamimember of the consulting staff for Magma Design Automation. Electronic Design, 10/17/2005

At the Design Automation Conference mid-June in Anaheim, California, an educational panel addressed the thermal issue in integrated circuit (IC) design. Two key questions were raised: When will this issue be emerging as a crucial concern if at all? What are the solutions to solve this potential crisis?

By Anne-Francoise Pele, EE Times Europe, 06/30/2008